仪器详情
用户评价
功能/应用范围：
The EVG501 is a highly flexible wafer bonding system that can handle substrate sizes from pieces to 200 mm.
主要技术指标：
Bonds up to 20 kN force at temperatures up to 450°C
Optimum total cost of ownership (TCO) for R&D and pilot line production
Unmatched pressure and temperature uniformity
High yield through automatic wedge compensation
Open chamber design for fast convers
服务内容：
The EVG501 is a highly flexible wafer bonding system that can handle substrate sizes from pieces to 200 mm.
服务典型成果：
暂无
用户须知：
暂无
收费标准：
面议