仪器详情
用户评价
功能/应用范围：
The EVG501 is a highly flexible wafer bonding system that can handle substrate sizes from pieces to 200 mm.
主要技术指标：
TWB-100
服务内容：
The EVG501 is a highly flexible wafer bonding system that can handle substrate sizes from pieces to 200 mm.
服务典型成果：
暂无
用户须知：
暂无
收费标准：
面议